Patents/Inventors

Chih-hua Chen

Hsinchu CountyTW24 patents

24 Patents

US125576812026
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124314462025
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US123942422025
Fingerprint Sensor Device and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122606692025
Fingerprint Sensor in Info Structure and Formation Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122551962025
Semiconductor Package with Thermal Relaxation Block and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120682122024
Package Structure with Through via Extending Through Redistribution Layer and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120581012024
Package Structure and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120173422024
Robot Gripper for Moving Wafer Carriers and Packing Materials and Method of Operating the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US120093222024
Package Structure with Through-via in Molding Compound and Dielectric Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US119617912024
Package Structures and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119488622024
Package Structures and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118478522023
Manufacturing Method of Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118307812023
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118308662023
Semiconductor Package with Thermal Relaxation Block and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117478992023
Gaze-based Window Adjustments
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
0 cites
US117496402023
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117417372023
Fingerprint Sensor in Info Structure and Formation Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd
0 cites
US117422172023
Passive Devices in Package-on-package Structures and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117277142023
Fingerprint Sensor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117123902023
Oral Rehabilitation Device and Medical Treatment System Therewith
CHANGHUA CHRISTIAN MEDICAL FOUNDATION CHANGHUA CHRISTIAN HOSPITAL
0 cites
US116850552023
Robot Gripper for Moving Wafer Carriers and Packing Materials and Method of Operating the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US116259402023
Fingerprint Sensor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115991902023
Pivotable Acoustic Devices
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
0 cites
US115807672023
Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites