Patents/Inventors

Chih-hsuan Tai

Taipei CityTW39 patents

28 Patents

US126044872026
Semiconductor Structure Having Deep Trench Capacitor and Method of Manufacturing Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
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US125577072026
Method of Fabricating Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
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US125123722025
Semiconductor Structure with Testing Pads and Method of Manufacturing Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US125002002025
Package Structure with Conductive Patterns in a Redistribution Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124697682025
Semiconductor Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
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US124314462025
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US123622742025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US123344342025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US122782082025
Method of Fabricating Semiconductor Structure Including a Barrier Structure in Between a Plurality of Surface Mount Components and a Wafer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122225452025
Package and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US122058602025
Sensor Packages
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121258102024
Delamination Sensor
TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121006822024
Package Structure with Conductive Patterns in a Redistribution Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120682122024
Package Structure with Through via Extending Through Redistribution Layer and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120150172024
Package Structure, Package-on-package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120093222024
Package Structure with Through-via in Molding Compound and Dielectric Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
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US119293182024
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US118552322023
Semiconductor Package and Forming Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118478522023
Manufacturing Method of Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118483002023
Semiconductor Structure Including a Semiconductor Wafer and a Surface Mount Component Overhanging a Periphery of the Semiconductor Wafer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118429932023
Semiconductor Device with Multiple Polarity Groups
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
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US117495822023
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117422542023
Sensor Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116355662023
Package and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116316582023
Under-bump-metallization Structure and Redistribution Layer Design for Integrated Fan-out Package with Integrated Passive Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116145922023
Semiconductor Devices and Methods of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116160292023
Delamination Sensor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115807672023
Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites