Patents/Inventors

Chih-hsien Lin

TainanTW6 patents

7 Patents

US123549592025
Redistribution Layer Features
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123227422025
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US122535582025
Circuit Test Structure and Method of Using
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120516222024
Passivation Layer and Planarization Layer and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118550662023
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US118287902023
Circuit Test Structure and Method of Using
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116705942023
Redistribution Layer Features
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites