Chih-horng Chang

8 Patents

• US125002002025

  Package Structure with Conductive Patterns in a Redistribution Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123745992025

  Package Structure Comprising a Semiconductor Die with Thermoelectric Elements and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121006822024

  Package Structure with Conductive Patterns in a Redistribution Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120877182024

  Bump Structure Having a Side Recess and Semiconductor Structure Including the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120149792024

  Methods of Forming Semiconductor Packages

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US119159942024

  Package Structure Comprising a Semiconductor Die with a Thermoelectric Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117768802023

  Surface Treatment Method and Apparatus for Semiconductor Packaging

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US116316482023

  Bump Structure Having a Side Recess and Semiconductor Structure Including the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites