Patents/Inventors

Chih-hao Chen

HsinchuTW48 patents

49 Patents

US126124042026
Ionic Compound, Absorbent and Absorption Device
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
0 cites
US126160252026
Semiconductor Package Fixture and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125819412026
Semiconductor Device and Method of Forming Thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124944012025
Semiconductor Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124631082025
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124445802025
Plasma Processing Apparatus and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124244482025
Reduction of Line Wiggling
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124128022025
Heat Dissipation Structures for Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123680842025
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123477712025
Semiconductor Device Having Fuse Array and Method of Making the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123005742025
Adhesive and Thermal Interface Material on a Plurality of Dies Covered by a Lid
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122439662025
Light-emitting Device
EPISTAR CORPORATION
0 cites
US122307442025
Light-emitting Device with a Plurality of Concave Parts on the Edge of the Semiconductor Mesa
EPISTAR CORPORATION
0 cites
US122242242025
Package Structure with Metallic Layer Over the Surfaces of a Plurality of Semiconductor Dies
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122182822025
Light-emitting Device
EPISTAR CORPORATION
0 cites
US122118182025
Manufacturing Method of Semiconductor Package Using Jig
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121762612024
Method of Fabricating Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121702362024
Method for Forming Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd
0 cites
US121550192024
Light-emitting Device
EPISTAR CORPORATION
0 cites
US121320042024
Semiconductor Devices and Methods of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121006402024
High Efficiency Heat Dissipation Using Thermal Interface Material Film
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120681732024
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
USD10365302024
Surveillance Camera
VIVOTEK Inc.
0 cites
USRE0500002024
Keyswitch Structure
DARFON ELECTRONICS Corp.
0 cites
US120027112024
Patterning Methods for Semiconductor Devices and Structures Resulting Therefrom
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119963452024
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119905752024
Light-emitting Device
EPISTAR CORPORATION
0 cites
US118942872024
Adhesive and Thermal Interface Material on a Plurality of Dies Covered by a Lid
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118698222024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118308212023
Semiconductor Devices and Methods of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118044682023
Manufacturing Method of Semiconductor Package Using Jig
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117990602023
Light-emitting Device with a Plurality of Concave Parts on the Edge of the Semiconductor Mesa
EPISTAR CORPORATION
0 cites
US117568552023
Method of Fabricating Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117570772023
Light-emitting Device
EPISTAR CORPORATION
0 cites
US117321932023
Display Panel
AU OPTRONICS CORPORATION
0 cites
US117055452023
Light-emitting Device
EPISTAR CORPORATION
0 cites
US117053812023
High Efficiency Heat Dissipation Using Thermal Interface Material Film
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116995972023
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116642862023
Method for Forming Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116520492023
Semiconductor Device and Method of Forming Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116410052023
Light-emitting Element and Manufacturing Method Thereof
EPISTAR CORPORATION
0 cites
US116315552023
Keyboard Device
CHICONY ELECTRONICS CO., Ltd.
0 cites
US116263682023
Semiconductor Device Having Fuse Array and Method of Making the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116262922023
Pattern Formation Method and Method for Manufacturing a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116263442023
Adhesive and Thermal Interface Material on a Plurality of Dies Covered by a Lid
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116213742023
Light-emitting Device with a Plurality of Electrodes on a Semiconductor Stack
EPISTAR CORPORATION
0 cites
US116045182023
Tactile-adjustable Keyboard and Hybrid Operation Button Thereof
DARFON ELECTRONICS Corp.
0 cites
US115944192023
Reduction of Line Wiggling
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115860682023
Display Apparatus
Au Optronics Corporation
0 cites