Patents/Inventors

Chih-chien Pan

TaipeiTW13 patents

13 Patents

US123005742025
Adhesive and Thermal Interface Material on a Plurality of Dies Covered by a Lid
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122666332025
Semiconductor Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122181172025
Method of Forming Package Structure and Package Structure Therefrom
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122118182025
Manufacturing Method of Semiconductor Package Using Jig
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121702362024
Method for Forming Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd
0 cites
US119424032024
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119012552024
Semiconductor Device and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118942872024
Adhesive and Thermal Interface Material on a Plurality of Dies Covered by a Lid
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118550542023
Method of Forming Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118044682023
Manufacturing Method of Semiconductor Package Using Jig
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117423232023
Semiconductor Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116642862023
Method for Forming Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116263442023
Adhesive and Thermal Interface Material on a Plurality of Dies Covered by a Lid
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites