Chien-wei Chang

5 Patents

• US125640912026

  Silicon Fragment Defect Reduction in Grinding Process

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US122341452025

  Methods for Wafer Bonding

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US120403122024

  Semiconductor Package Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118507022023

  Chemical Mechanical Planarization Membrane

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118513252023

  Methods for Wafer Bonding

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites