Chien Ming Chen

7 Patents

• US125685822026

  Electronic Module

  CYNTEC CO., Ltd.

  0 cites
• US125327752026

  Methods and Assemblies for Measurement and Prediction of Package and Die Strength

  Micron Technology, Inc.

  0 cites
• US125087412025

  Ingot Wafering Systems and Methods for Slicing a Silicon Ingot

  Globalwafers Co., Ltd.

  0 cites
• US122197082025

  Electronic Module

  CYNTEC CO., Ltd.

  0 cites
• US121156992024

  Ingot Wafering Systems and Methods for Slicing a Silicon Ingot

  Globalwafers Co., Ltd.

  0 cites
• US118481462023

  Stacked Electronic Module and Method to Make the Same

  CYNTEC CO., Ltd.

  0 cites
• US117526652023

  Slurry Sprayers, Adjustable Supports for Same, and Methods for Slicing a Silicon Ingot

  Globalwafers Co., Ltd.

  0 cites