Patents/Inventors

Chien-hua Chen

KaohsiungTW35 patents

36 Patents

US125816682026
Semiconductor Device Packages Including an Inductor and a Capacitor
Advanced Semiconductor Engineering, Inc.
0 cites
US123910442025
Fluid Ejection Device with Break(s) in Cover Layer
Hewlett-packard Development Company, L.P.
0 cites
US123437282025
Thermally Controlled Reagent Release
Hewlett-packard Development Company, L.P.
0 cites
US122818512025
Loop Heat Pipe Evaporator
ADVANCED COOLING TECHNOLOGIES, Inc.
0 cites
US122634842025
Microfluidic Devices
Hewlett-packard Development Company, L.P.
0 cites
US122335982025
Processes for Formation of Molded Panels by Bringing Release Liner of Mold Chase in Direct Contact with Protective Layer
Hewlett-packard Development Company, L.P.
0 cites
US121342742024
Molded Structures with Channels
Hewlett-packard Development Company, L.P.
0 cites
US120977112024
Fluid-ejection Die with Stamped Nanoceramic Layer
Hewlett-packard Development Company, L.P.
0 cites
US120582072024
Load Balancing and Secure Tunneling for Cloud-based Network Controllers
Ruckus IP Holdings LLC
0 cites
US119754682024
Coplanar Modular Printbars
Hewlett-packard Development Company, L.P.
0 cites
US119043122024
Microfluidic Devices with Lid for Loading Fluid
Hewlett-packard Development Company, L.P.
0 cites
US118270212023
Applying Mold Chase Structure to End Portion of Fluid Ejection Die
Hewlett-packard Development Company, L.P.
0 cites
US118075232023
Three-dimensional Features Formed in Molded Panel
Hewlett-packard Development Company, L.P.
0 cites
US117802262023
Fluid Ejection Devices
Hewlett-packard Development Company, L.P.
0 cites
US117802272023
Molded Structures with Channels
Hewlett-packard Development Company, L.P.
0 cites
US117455072023
Fluid Ejection Device with Break(s) in Cover Layer
Hewlett-packard Development Company, L.P.
0 cites
US117216362023
Circuit Die Alignment Target
Hewlett-packard Development Company, L.P.
0 cites
US116914232023
Uniform Print Head Surface Coating
Hewlett-packard Development Company, L.P.
0 cites
US116914312023
Fluid Circulation and Ejection
Hewlett-packard Development Company, L.P.
0 cites
US116731072023
Sequential Encapsulation of Reagents
Hewlett-packard Development Company, L.P.
0 cites
US116669082023
Microfluidic Package
Hewlett-packard Development Company, L.P.
0 cites
US116546802023
Fluidic Ejection Dies with Enclosed Cross-channels
Hewlett-packard Development Company, L.P.
0 cites
US116428852023
Fluid Ejection Device Including Fluid Output Channel
Hewlett-packard Development Company, L.P.
0 cites
US116371722023
Semiconductor Device Packages Including an Inductor and a Capacitor
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US116058772023
Semiconductor Device Package and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US115972042023
Fluid Ejection Polymeric Recirculation Channel
Hewlett-packard Development Company, L.P.
0 cites
US115976462023
Microfluidic Device with Manifold
Hewlett-packard Development Company, L.P.
0 cites
US115838612023
Microfluidic Devices
Hewlett-packard Development Company, L.P.
0 cites
US115772522023
Thermally Controlled Reagent Release
Hewlett-packard Development Company, L.P.
0 cites
US115774562023
Molded Panels
Hewlett-packard Development Company, L.P.
0 cites
US115655212023
Fluid Ejection Device with a Portioning Wall
Hewlett-packard Development Company, L.P.
0 cites
US115599872023
Fluidic Die with Surface Condition Monitoring
Hewlett-packard Development Company, L.P.
0 cites
US115482872023
Fluidic Die Assemblies with Rigid Bent Substrates
Hewlett-packard Development Company, L.P.
0 cites
US115416582023
Fluidic Die with Nozzle Layer Electrode for Fluid Control
Hewlett-packard Development Company, L.P.
0 cites
US115416592023
Molded Printhead
Hewlett-packard Development Company, L.P.
0 cites
US115454272023
Capacitor Bank Structure and Semiconductor Package Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites