Chie Sugama

4 Patents

• US125648792026

  Copper Paste for Joining, Method for Manufacturing Joined Body, and Joined Body

  RESONAC CORPORATION

  0 cites
• US118906812024

  Method for Producing Bonded Object and Semiconductor Device and Copper Bonding Paste

  RESONAC CORPORATION

  0 cites
• US118879602024

  Member Connection Method

  RESONAC CORPORATION

  0 cites
• US115750762023

  Method for Manufacturing Thermoelectric Conversion Module, Thermoelectric Conversion Module, and Binder for Thermoelectric Conversion Module

  Showa Denko Materials Co., Ltd.

  0 cites