Patents/Inventors

Chia-wen Tsao

Taichung CityTW4 patents

4 Patents

US125936942026
Electronic Package and Substrate Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US122781732025
Electronic Package and Substrate Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US121548482024
Electronic Package and Manufacturing Method Thereof, and Substrate Structure
Siliconware Precision Industries Co., Ltd.
0 cites
US117322312023
Composite Membrane and Manufacturing Method Thereof
NATIONAL CENTRAL UNIVERSITY
0 cites