14 Patents
- US125990452026Sensor Chips Having Columnar Microstructures Embedded and Surrounded by Adhesive Layer in a Package Structure and Manufacturing Method Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US125000922025Chip Package Structure and Method for Fabricating the Same
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
- US124827372025Intelligent Power Module Package Structure and Hybrid Ceramic Board
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
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- US121744462024Sensor Lens Assembly Having Non-soldering Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
- US121085172024Sensor Lens Assembly Having Non-soldering Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US117924972023Sensor Lens Assembly Having Non-reflow Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US117642402023Method of Manufacturing Image Sensing Chip Package Structure Including an Adhesive Loop
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US117440102023Sensor Lens Assembly Having Non-reflow Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US117231472023Sensor Lens Assembly Having Non-reflow Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites