31 Patents
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- US124429822025Temperature Sensor to Achieve Thermal Stabilization of Micro-ring Resonator (MRR) in an Open Cavity Photonic Integrated Circuit (OCPIC)
Intel Corporation
0 cites - US124430582025On-cavity Photonic Integrated Circuit (OCPIC) to Achieve the Most Undercut Real Estate for Effective Thermal Tuning
Intel Corporation
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- US122939562025Boiling Enhancement Structures for Immersion Cooled Electronic Systems
Intel Corporation
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- US121130262024Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
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- US120948002024Thermally Conductive Slugs/active Dies to Improve Cooling of Stacked Bottom Dies
Intel Corporation
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- US118760532024Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites - US118549312023Stim/liquid Metal Filled Laser Drill Trench to Improve Cooling of Stacked Bottom Die
Intel Corporation
0 cites - US118375192023Heatsink Cutout and Insulating Through Silicon Vias to Cut Thermal Cross-talk
Intel Corporation
0 cites - US118240082023Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
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- US1167056120233D Buildup of Thermally Conductive Layers to Resolve Die Height Differences
Intel Corporation
0 cites - US116520202023Thermal Solutions for Multi-package Assemblies and Methods for Fabricating the Same
Intel Corporation
0 cites - US116462442023Socket Loading Mechanism for Passive or Active Socket and Package Cooling
Intel Corporation
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- US115519942023Liquid Metal TIM with Stim-like Performance with No BSM and BGA Compatible
Intel Corporation
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