Chia-nan Yuan

4 Patents

• US123682802025

  Semiconductor Device and Method

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123411042025

  Methods of Manufacturing Semiconductor Devices

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120339492024

  Package Structure with Bridge Die Laterally Wrapped by Insulating Encapsulant and Surrounded by Through Vias and Method of Forming the Package Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119358362024

  Semiconductor Devices

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites