Chia-ming Cheng

5 Patents

• US124778482025

  Chip Package and Method for Forming the Same

  XINTEC Inc.

  0 cites
• US123411092025

  Chip Package and Manufacturing Method Thereof

  XINTEC Inc.

  0 cites
• US119730952024

  Method for Forming Chip Package with Second Opening Surrounding First Opening Having Conductive Structure Therein

  XINTEC Inc.

  0 cites
• US117841342023

  Chip Package and Manufacturing Method Thereof

  XINTEC Inc.

  0 cites
• US117496182023

  Chip Package Including Substrate Having Through Hole and Redistribution Line

  XINTEC Inc.

  0 cites