Chia-ling Yeh

5 Patents

• US126159732026

  Strain Relief Trenches for Epitaxial Growth

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US124190742025

  Barrier Structure Configured to Increase Performance of III-V Devices

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118551992023

  High Electron Mobility Transistor (HEMT) with a Back Barrier Layer

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US118043742023

  Strain Relief Trenches for Epitaxial Growth

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117157922023

  Barrier Structure Configured to Increase Performance of III-V Devices

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites