Chia Jung Hsu

3 Patents

• US123745252025

  Plasma Processing Tool and Operating Method Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US122372992025

  Systems and Methods for Direct Bonding in Semiconductor Die Manufacturing

  Micron Technology, Inc.

  0 cites
• US118174202023

  Systems and Methods for Direct Bonding in Semiconductor Die Manufacturing

  Micron Technology, Inc.

  0 cites