Patents/Inventors

Chia-hung Liu

Hsinchu CityTW25 patents

24 Patents

US125688272026
Method for Fabricating Device Die
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125577072026
Method of Fabricating Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124154172025
Three-dimensional Touch Device and Manufacturing Method Thereof
DARWIN PRECISIONS CORPORATION
0 cites
US123811632025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123622742025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123344342025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122060102025
Method for Forming a Semiconductor Structure
WINBOND ELECTRONICS Corp.
0 cites
US121762792024
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121130222024
Semiconductor Package and Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120682122024
Package Structure with Through via Extending Through Redistribution Layer and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120150172024
Package Structure, Package-on-package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120027682024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119293182024
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119160252024
Device Die and Method for Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118552322023
Semiconductor Package and Forming Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118478522023
Manufacturing Method of Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118384192023
Method and System for Monitoring Industrial Devices
DELTA ELECTRONICS, Inc.
0 cites
US118307962023
Circuit Substrate, Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117568722023
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117353802023
Keyswitch Structure and Keyboard
DARFON ELECTRONICS Corp.
0 cites
US116644382023
Semiconductor Structure and Method for Forming the Same
WINBOND ELECTRONICS Corp.
0 cites
US116316422023
Method for Manufacturing Semiconductor Device
Winbond Electronics Corp.
0 cites
US115807672023
Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115518882023
Keyswitch Structure and Keyboard
DARFON ELECTRONICS Corp.
0 cites