Patents/Inventors

Chia-hsiang Lin

ZhubeiTW8 patents

8 Patents

US125576562026
Stacking via Structures for Stress Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123879922025
Package and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123227032025
Eccentric via Structures for Stress Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122180802025
Package Structure with Reinforced Element
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120948282024
Eccentric via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118550082023
Stacking via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116706012023
Stacking via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116056002023
Package Structure with Reinforced Element and Formation Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites