Chia-han Lai

3 Patents

• US124827052025

  Conductive Feature Formation and Structure Using Bottom-up Filling Deposition

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US123621982025

  Interface Tool and Methods of Operation

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119293142024

  Interconnect Structures Including a Fin Structure and a Metal Cap

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites