Chia-feng Hsiao

2 Patents

• US118218472023

  Wafer Backside Defect Detection Method and Wafer Backside Defect Detection Apparatus

  UNITED MICROELECTRONICS Corp.

  0 cites
• US116444272023

  Automatic Detection Method and Automatic Detection System for Detecting Crack on Wafer Edges

  UNITED MICROELECTRONICS Corp.

  0 cites