Patents/Inventors

Chia-chu Lai

Taichung CityTW16 patents

17 Patents

US125936982026
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US125001452025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US124382662025
Electronic Package and Manufacturing Method Thereof, and Antenna Module and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US123680812025
Electronic Package Comprising Conductive Layer Connected Electrode Pad Through Electronic Component
Siliconware Precision Industries Co., Ltd.
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US123344252025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US122939522025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US121006332024
Electronic Package Comprising Wire Inside an Electronic Component
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US121006482024
Electronic Module, Manufacturing Method Thereof and Electronic Package Having the Same
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US120682112024
Electronic Package Comprising Multiple Wires Inside an Electronic Component
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US120685352024
Electronic Package and Manufacturing Method Thereof, and Antenna Module and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US120576182024
Electronic Package and Fabrication Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US120277532024
Electronic Package and Antenna Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US120149672024
Manufacturing Method of Electronic Package Comprising a Wire Within an Electronic Component
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US117768972023
Electronic Module, Manufacturing Method Thereof and Electronic Package Having the Same
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US117282342023
Electronic Package Comprising Wire Inside an Electronic Component and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US116828262023
Electronic Package and Fabrication Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US116706072023
Electronic Package
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites