Chia-chia Lin

3 Patents

• US125882222026

  Semiconductor Package Including an Integrated Circuit Die and an Inductor or a Transformer

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US125045882025

  Semiconductor Device and Methods of Manufacture

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US120210472024

  Semiconductor Packages Having a Die, an Encapsulant, and a Redistribution Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites