Chia-cheng Tsai

5 Patents

• US125640912026

  Silicon Fragment Defect Reduction in Grinding Process

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US125324922026

  Structure and Formation Method of Semiconductor Device with Epitaxial Structures

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US123395782025

  Variable Aperture Module, Imaging Lens Module and Electronic Device

  LARGAN PRECISION CO., Ltd.

  0 cites
• US120256532024

  Artificial Intelligence-based Constrained Random Verification Method for Design Under Test and Non-transitory Machine-readable Medium for Storing Program Code That Performs Artificial Intelligence-based Constrained Random Verification Method When Executed

  MEDIATEK Inc.

  0 cites
• US120193652024

  Variable Aperture Module, Imaging Lens Module and Electronic Device

  LARGAN PRECISION CO., Ltd.

  0 cites