4 Patents
- US121835902024Method of Performing Gap Filling Including Filling Trenches Between Dummy Gate Stacks on Semiconductor Fins/strips with Semiconductor Material
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120878452024System and Methods of Manufacturing Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117107772023Semiconductor Device and Method for Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116055432023Method of Gap Filling Using Conformal Deposition-annealing-etching Cycle for Reducing Seam Void and Bending
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. Ltd.
0 cites