Chi-yuan Chen

7 Patents

• US125885222026

  Semiconductor Package Structure

  MEDIATEK Inc.

  0 cites
• US123881942025

  Antenna-in-module Package-on-package with Air Trenches

  MEDIATEK Inc.

  0 cites
• USD10688812025

  Embellishing Plate of Cutting Tool

  ALLPROFESSIONAL MFG. CO., Ltd.

  0 cites
• US120806142024

  Lidded Semiconductor Package

  MEDIATEK Inc.

  0 cites
• USD10393562024

  Handle of a Cutting Tool

  ALLPROFESSIONAL MFG. CO., Ltd.

  0 cites
• US119675702024

  Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure

  Mediatek Inc.

  0 cites
• US117054132023

  Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure

  MEDIATEK Inc.

  0 cites