Patents/Inventors

Chi-yang Yu

TaoyuanTW13 patents

14 Patents

US124179682025
Package Structure and Forming Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124128622025
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123681122025
Electronic Component and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123478022025
Die Corner Removal for Underfill Crack Suppression in Semiconductor Die Packaging
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US122305892025
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121659462024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120626042024
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119088352024
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US118550572023
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118240322023
Die Corner Removal for Underfill Crack Suppression in Semiconductor Die Packaging
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US117841062023
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117495942023
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117054082023
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116160372023
Integrated Fan-out Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites