Patents/Inventors

Chi-hsueh Li

TainanTW15 patents

10 Patents

US126222862026
Side-wettable Semiconductor Package Device with Heat Dissipation Surface Structure
PANJIT INTERNATIONAL Inc.
0 cites
US124084072025
Metal Oxide Semiconductor with Multiple Drain Vias
PANJIT INTERNATIONAL Inc.
0 cites
US122887372025
Thin Semiconductor Packaging Unit Having a Plurality of Bridging Layers
PANJIT INTERNATIONAL Inc.
0 cites
US122242282025
Packaged Component with Composite Pin Structure and Manufacturing Method Thereof
PANJIT INTERNATIONAL Inc.
0 cites
US121486752024
Power Semiconductor Package Unit of Surface Mount Technology Including a Plastic Film Covering a Chip
Panjit International Inc.
0 cites
US119160302024
Method for Manufacturing Side Wettable Package
PANJIT INTERNATIONAL Inc.
0 cites
US118482542023
Method for Manufacturing a Semiconductor Package Having a Conductive Pad with an Anchor Flange
Panjit International Inc.
0 cites
US116643452023
Semiconductor Package Element
PANJIT INTERNATIONAL Inc.
0 cites
US115944252023
Semiconductor Package Structure and Fabricating Method of the Same
PANJIT INTERNATIONAL Inc.
0 cites
US115629472023
Semiconductor Package Having a Conductive Pad with an Anchor Flange
Panjit International Inc.
0 cites