Chi-hing Choi

4 Patents

• US125934862026

  Dual Contact Process with Selective Deposition

  Intel Corporation

  0 cites
• US125686442026

  Contact Over Active Gate Structures with Trench Contact Layers for Advanced Integrated Circuit Structure Fabrication

  Intel Corporation

  0 cites
• US124396692025

  Co-deposition of Titanium and Silicon for Improved Silicon Germanium Source and Drain Contacts

  Intel Corporation

  0 cites
• US124263422025

  Low Germanium, High Boron Silicon Rich Capping Layer for PMOS Contact Resistance Thermal Stability

  Intel Corporation

  0 cites