Patents/Inventors

Chi-feng Lin

HsinchuTW10 patents

10 Patents

US125576312026
Low-resistance Copper Interconnects
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124697452025
Conductive Structures with Bottom-less Barriers and Liners
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123411012025
Method for Forming a Semiconductor Structure by Diffusing Manganese from a Seed Layer to a Barrier Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123343972025
Interconnect Structure Including Graphite and Method Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123157642025
Conductive Structures with Barriers and Liners of Varying Thicknesses
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122372612025
Semiconductor Device Having a Contact Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121659752024
Method of Forming Interconnect Structure Having a Barrier Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US119963612024
Method of Making a Contact Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117422902023
Interconnect Structure and Method of Forming Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116520442023
Contact Structure and Method of Making
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites