Patents/Inventors

Chi-chun Po

New TaipeiTW2 patents

3 Patents

US121563252024
Package Carrier with Improved Heat Dissipation Efficiency and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116417202023
Circuit Board and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116316262023
Package Structure
Unimicron Technology Corp.
0 cites