Patents/Inventors

Chengchung Lin

Jiangyin CityCN27 patents

27 Patents

US126160642026
Three-dimensional Fan-out Integrated Package Structure, Packaging Method Thereof, and Wireless Headset
SJ Semiconductor(jiangyin) Corporation
0 cites
US126108682026
Fan-out Stacked Semiconductor Package Structure and Packaging Method Thereof
SJ Semiconductor(jiangyin) Corporation
0 cites
US125885442026
Packaging Structure and Packaging Method
SJ Semiconductor(jiangyin) Corporation
0 cites
US125507402026
Chip Packaging Structure and Method for Manufacturing Same
SJ Semiconductor(jiangyin) Corporation
0 cites
US125124112025
Wafer-level ASIC 3D Integrated Substrate, Packaging Device and Preparation Method
SJ Semiconductor(jiangyin) Corporation
0 cites
US124827592025
Wafer-level ASIC 3D Integrated Substrate, Packaging Device and Preparation Method
SJ Semiconductor(jiangyin) Corporation
0 cites
US122834932025
Packaging Structure Radiating Electromagnetic Waves in Horizontal Direction and Method Making the Same
SJ Semiconductor (Jiangyin) Corporation
0 cites
US121989422025
Packaging Structure and Method for Preparing Same
SJ Semiconductor(jiangyin) Corporation
0 cites
US121320362024
Fan-out LED Packaging Structure and Method
SJ Semiconductor(jiangyin) Corporation
0 cites
US121192952024
Wafer System-level Three-dimensional Fan-out Three-dimensional Fan-out Packaging Structure and Manufacturing Method Thereof
SJ Semiconductor (Jiangyin) Corporation
0 cites
US121130452024
Three-dimensional Stacked Fan-out Packaging Structure and Method Making the Same
SJ Semiconductor(jiangyin) Corporation
0 cites
US120405462024
Packaging Structure Radiating Electromagnetic Wave in Horizontal Direction and Vertical Direction and Method Making the Same
SJ Semiconductor(jiangyin) Corporation
0 cites
US119730702024
Double-layer Stacked 3D Fan-out Packaging Structure and Method Making the Same
SJ Semiconductor (Jiangyin) Corporation
0 cites
US119730462024
Semiconductor Structure and Method for Preparing the Same
SJ Semiconductor (Jiangyin) Corporation
0 cites
US118943572024
System-level Packaging Structure and Method for LED Chip
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites
US118942432024
Wafer System-level Fan-out Packaging Structure and Manufacturing Method
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites
US118429762023
Semiconductor Package Structure with Heat Sink and Method Preparing the Same
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites
US117988882023
Chip Packaging Structure and Method for Preparing Same
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites
US117569422023
Fan-out Packaging Structure and Method
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites
US117568712023
Fan-out Packaging Structure and Method
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites
US117496572023
Fan-out Packaging Structure and Method
SJ Semiconductor (Jiangyin) Corporation
0 cites
US117355642023
Three-dimensional Chip Packaging Structure and Method Thereof
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites
US117281582023
Semiconductor Structure and Method for Preparing the Same
SJ Semiconductor (Jiangyin) Corporation
0 cites
US117285582023
Semiconductor Structure Including Antenna
0 cites
US116998402023
Antenna Package Structure and Antenna Packaging Method
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites
US116266572023
Antenna Packaging Module and Making Method Thereof
HAUWEI DEVICE CO., Ltd
0 cites
US116056042023
Fan-out Antenna Packaging Structure and Packaging Method
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
0 cites