Patents/Inventors

Cheng-yuan Kung

KaohsiungTW17 patents

15 Patents

US125937402026
Package Structure
Advanced Semiconductor Engineering, Inc.
0 cites
US125138152025
Electronic Device and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US124631572025
Electronic Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US123681042025
Electronic Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US122727662025
Semiconductor Device Package and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US122180752025
Package Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US120516582024
Semiconductor Package Structure and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US119358412024
Semiconductor Package Structure and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US119238252024
Semiconductor Device and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117988902023
Assembly Structure and Package Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117841112023
Semiconductor Device and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117568962023
Semiconductor Package Structure Including Shielding Layer Contacting Conductive Contact
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117222202023
System Comprising Packaged Optical Devices
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US115946602023
Semiconductor Device Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US115454272023
Capacitor Bank Structure and Semiconductor Package Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites