Cheng-yen Hsieh

4 Patents

• US124314352025

  Semiconductor Packages and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123745992025

  Package Structure Comprising a Semiconductor Die with Thermoelectric Elements and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119159942024

  Package Structure Comprising a Semiconductor Die with a Thermoelectric Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US115454382023

  Semiconductor Packages and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites