Patents/Inventors

Cheng-wei Lee

Hsin-ChuTW3 patents

3 Patents

US125557252026
Button Structure
AUO CORPORATION
0 cites
US120437702024
Temporary Bonding Composition, Temporary Bonding Film, Composite Film, Temporary Bonding Method and Semiconductor Wafer Package
Daxin Materials Corporation
0 cites
US117943812023
Laser-debondable Composition, Laminate Thereof, and Laser-debonding Method
DAXIN MATERIALS CORPORATION
0 cites