Cheng-ting Chen

8 Patents

• US124890302025

  Methods of Manufacturing Integrated Fan-out Packages with Embedded Heat Dissipation Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US122610882025

  Package Structure and Method of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121440652024

  Warpage Control in the Packaging of Integrated Circuits

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US120516552024

  Package Structure and Method of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119964002024

  Manufacturing Method of Package on Package Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119012582024

  Iintegrated Fan-out Packages with Embedded Heat Dissipation Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US118745132024

  Package Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US115859922023

  Package Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites