Patents/Inventors

Cheng-tang Wu

Livermore, CAUS1 patent

2 Patents

US121477412024
Systems and Methods of Simulating Drop Shock Reliability of Solder Joints with a Multi-scale Model
ANSYS, Inc.
0 cites
US117207262023
Systems and Methods of Simulating Drop Shock Reliability of Solder Joints with a Multi-scale Model
ANSYS Inc.
0 cites