Cheng-tai Hsiao

3 Patents

• US122900032025

  Conductive Structure Connection with Interconnect Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121856402024

  MRAM MTJ with Directly Coupled Top Electrode Connection

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US115946792023

  Structure Improving Reliability of Top Electrode Contact for Resistance Switching RAM Having Cells of Varying Height

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites