Patents/Inventors

Cheng-nan Lin

Hsinchu CityTW10 patents

8 Patents

US125819352026
Stacked via Structures and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125327382026
Chip Package Structure with Heat Conductive Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124761662025
Inverted Trapezoidal Heat Dissipating Solder Structure and Method of Making the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122887302025
Semiconductor Device, Semiconductor Package, and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122180772025
Semiconductor Device Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US121193122024
Device Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US119012562024
Semiconductor Device, Semiconductor Package, and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117054122023
Device Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites