Patents/Inventors

Cheng-lin Huang

HsinchuTW10 patents

12 Patents

US124890452025
Package Structure with Through Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123811142025
Package Structure with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122551732025
Chip Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121837092024
Chip Package Structure with Ring-like Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120876182024
Method for Forming Semiconductor Die Having Edge with Multiple Gradients
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119488762024
Package Structure with Through Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118548262023
Metal Oxide Layered Structure and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118550392023
Chip Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118483022023
Chip Package Structure with Ring-like Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117840912023
Structure and Formation Method of Chip Package with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US115691592023
Structure and Formation Method of Chip Package with Through Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115454632023
Chip Package Structure with Ring-like Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites