Cheng-i Chu

5 Patents

• US124890822025

  Metal Nanoparticles in an Amorphous Bonding Layer Between a Device Substrate and Carrier Substrate

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US122495922025

  Dynamic Bonding Gap Control and Tool for Wafer Bonding

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US122118202025

  Wafer Bonding Apparatus and Method

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US120403822024

  Method of Forming a Nano-fet Semiconductor Device

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US119904042024

  Heat Dissipation for Semiconductor Devices and Methods of Manufacture

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites