4 Patents
- 0 cites
- US122232522025Through-silicon via in Integrated Circuit Packaging
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US116949732023Electromagnetic Shielding Metal-insulator-metal Capacitor Structure
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US115867972023Through-silicon Vias in Integrated Circuit Packaging
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites