8 Patents
- US125576292026Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123549102025Bi-layer Alloy Liner for Interconnect Metallization and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123477282025Bi-layer Alloy Liner for Interconnect Metallization and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123226492025Interconnect Structure of Semiconductor Device
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US120947702024Ruthenium-based Liner for a Copper Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120805942024Thermally Stable Copper-alloy Adhesion Layer for Metal Interconnect Structures and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US118548782023Bi-layer Alloy Liner for Interconnect Metallization and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING Ltd.
0 cites - US116768982023Diffusion Barrier for Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites