Chen-yu Wang

7 Patents

• US125435812026

  Flip-chip Bonding Structure and Substrate Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US125388052026

  Semiconductor Package and Method of Manufacturing the Same

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US123947682025

  Package Structure

  Ganrich Semiconductor Corporation

  0 cites
• US123174622025

  Electronic Package and Method of Manufacturing the Same

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US122241832025

  Method of Manufacturing Semiconductor Device

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• USD10593152025

  Package Structure for a Semiconductor Element

  Ganrich Semiconductor Corporation

  0 cites
• US121460492024

  Styrene-isoprene/butadiene Diblock Copolymer, Hydrogenated Block Copolymer, Composition Formed Therefrom, and the Use Thereof

  LCY CHEMICAL Corp.

  0 cites