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Inventors
Chen-nan Lai
Shenzhen
CN
2 patents
3 Patents
US11876037
2024
Chip Stacking and Packaging Structure
HOSIN GLOBAL ELECTRONICS CO., Ltd
0 cites
US11764184
2023
Chip Packaging Device, Chip Packaging Method, and Package Chip
HOSIN GLOBAL ELECTRONICS CO., Ltd
0 cites
US11609713
2023
Storage Device and Storage Control Method
HOSIN GLOBAL ELECTRONICS CO., Ltd
0 cites