Chen-hung Tsai

4 Patents

• US125435532026

  Forming Liners to Facilitate the Formation of Copper-containing Vias in Advanced Technology Nodes

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US123763602025

  Silicide Backside Contact

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US117283972023

  Integrated Circuits Having Protruding Interconnect Conductors

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US115693642023

  Silicide Backside Contact

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites