Chen-hsuan Yen

3 Patents

• US122305502025

  Structures and Methods for Heat Dissipation of Semiconductor Devices

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US121226652024

  Micro-electromechanical System Device Using a Metallic Movable Part and Methods for Forming the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites
• US116580882023

  Structures and Methods for Heat Dissipation of Semiconductor Devices

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites