Patents/Inventors

Chen-hsiao Wang

HsinchuTW2 patents

3 Patents

US124827772025
Copper Pillar Bump Structure and Method of Manufacturing the Same
UNITED MICROELECTRONICS Corp.
0 cites
US123879982025
QFN Package and Fabricating Method of the Same
UNITED MICROELECTRONICS Corp.
0 cites
US118486602023
Surface Acoustic Wave Device Fabrication Method
UNITED MICROELECTRONICS Corp.
0 cites