Chen-fu Chu

4 Patents

• US124264102025

  Semiconductor Components and Semiconductor Structures and Methods of Fabrication

  TSLC Corporation

  0 cites
• US123176592025

  Method of Making a Packaged Device

  TSLC Corporation

  0 cites
• US118627542024

  Method for Fabricating (LED) Dice Using Semiconductor Structures on a Substrate and Laser Lift-off to a Receiving Plate

  Shin-etsu Chemical Co., Ltd.

  0 cites
• US118627552024

  Method for Fabricating (LED) Dice Using Laser Lift-off from a Substrate to a Receiving Plate

  Shin-etsu Chemical Co., Ltd.

  0 cites