Chee Yang Ng

8 Patents

• US126160392026

  Electronic System Having Intermetallic Connection Structure with Central Intermetallic Mesh Structure and Mesh-free Exterior Structures

  Infineon Technologies AG

  0 cites
• US124127972025

  Hybrid Embedded Package

  Infineon Technologies AG

  0 cites
• US122323022025

  Dipped Coated Electronic Module Assembly with Enhanced Thermal Distribution

  Infineon Technologies Austria AG

  0 cites
• US121502362024

  Voltage Regulator Module with Inductor-cooled Power Stage

  Infineon Technologies Austria AG

  0 cites
• US121365832024

  Method of Forming a Chip Package, Method of Forming a Semiconductor Arrangement, Chip Package, and Semiconductor Arrangement

  Infineon Technologies AG

  0 cites
• US120948072024

  Stacked Transistor Chip Package with Source Coupling

  Infineon Technologies AG

  0 cites
• US119843922024

  Semiconductor Package Having a Chip Carrier with a Pad Offset Feature

  Infineon Technologies AG

  0 cites
• US116768792023

  Semiconductor Package Having a Chip Carrier and a Metal Plate Sized Independently of the Chip Carrier

  Infineon Technologies AG

  0 cites